Ahadul Imam, MIST (EECE) graduate has just joined Qualcomm Snapdragon, California, USA as IC Packaging Engineer. The date of joining was 1st September 2022.

He graduated from the EECE-08 Department of Military Institute of Science and Technology (MIST) and pursued his MSc in Electrical Engineering from California State University, Long Beach, Los Angeles, CA which is a public university in the USA.

He passed his HSC in Science from Munshi Abdur Rouf Rifles College and SSC from Government Laboratory School, Dhaka with excellent first-class results at all academic levels.

Being an Electrical Engineering graduate he has shown a splendid performance in competitive programming in the USA.

He ranked 64th (among the top 5%) in the Open Bracket Coding Challenge on Hacker Rank

He ranked 119th position in USA Walmart Labs, Code Sprint on Hacker Rank.

He ranked 96th in the USA in NCR Code Sprint on Hacker Rank.

During his undergraduate level at MIST, he was an excellent coder and an active participant in different inter-university Design, Programming, and Gaming contests. He is a Cisco-certified CCNA professional.

He worked as an IC Packaging Engineer in Marvell Technology Group, Fishkill, New York, USA (Nov 2019- August 2022)

He worked in Global Foundries Technology, Fishkill, NY USA (April 2017- Nov 2019) as a Senior IC Engineer.

He worked in Broadcom Corporation, Irvine California, USA (Feb 2015 – Feb 2017) as an IC Packaging Engineer which is a direct competitor to Intel, AMD, and NVIDIA

Information: Muntasir Ahmad Nasif