Ahadul Imam has joined Qualcomm
Ahadul Imam, MIST (EECE) graduate has just joined Qualcomm Snapdragon, California, USA as IC Packaging Engineer. The date of joining was 1st September 2022. He graduated from the EECE-08 Department of Military Institute of Science and Technology (MIST) and pursued his MSc in Electrical Engineering from California State University, Long Beach, Los Angeles, CA which [...]