Qualcomm

Ahadul Imam, MIST (EECE) graduate has just joined Qualcomm Snapdragon, California, USA as IC Packaging Engineer. The date of joining was 1st September 2022. He graduated from the EECE-08 Department of Military Institute of Science and Technology (MIST) and pursued his MSc in Electrical Engineering from California State University, Long Beach, Los Angeles, CA which [...]